The diamond thinning pad provided by our company adopts the most advanced 3D intaglio copy technology in the world. The diamond powder and filler glue are used to consolidate several identical small cubes on the PC substrate according to certain methods. It can be used in the thinning process of glass, silicon wafer, sapphire, ceramic mobile phone shell and other products.

Features:

1. The same cube structure design can keep high grinding cutting force, and the cutting force is stable and consistent;

2. After grinding, the surface quality of the glass is good and the roughness is low, which can shorten the polishing time by 20-30%;

3. It can reduce the production of fragments and improve the yield;

4. It is easy to operate. During operation, it is only necessary to paste diamond thinning pad on the iron plate, tear it off and replace it with another set;

5. There is no need to invest in new equipment, in addition, the cost of iron plate can be saved;

6. Economic and environmental

Normal Grit :

40um—20um—9um—4um

Normal Size：

Φ260mm--Φ1100mm

Application：

Wafer thinning	Sapphire substrate	Cover lens	Ceramic mobile phone shell